Data SheetADP7185ABSOLUTE MAXIMUM RATINGS temperature (TJ) of the device is dependent on the ambient Table 3. temperature (TA), the power dissipation of the device (PD), and Parameter Rating the junction to ambient thermal resistance of the package (θJA). VIN to GND +0.3 V to −6 V Use the following equation to calculate the junction temperature VOUT to GND +0.3 V to −VIN (T EN to GND +5.0 V to −6 V J) from the ambient temperature (TA) and power dissipation (PD): VA to GND +0.3 V to −6 V TJ = TA + (PD × θJA) VAFB to GND +0.3 V to −6 V The junction to ambient thermal resistance (θJA) of the package VREG to GND +0.3 V to −2.16 V is based on modeling and calculation using a 4-layer board. The SENSE to GND +0.3 V to −6 V junction to ambient thermal resistance is highly dependent on Storage Temperature Range −65°C to +150°C the application and board layout. In applications where high Operating Junction Temperature Range −40°C to +125°C maximum power dissipation exists, close attention to thermal Soldering Conditions JEDEC J-STD-020 board design is required. The θJA value may vary, depending on Stresses at or above those listed under Absolute Maximum the PCB material, layout, and environmental conditions. The Ratings may cause permanent damage to the product. This is a specified θJA values are based on a 4-layer, 4 in. × 3 in. circuit board. stress rating only; functional operation of the product at these THERMAL RESISTANCE or any other conditions above those indicated in the operational Thermal performance is directly linked to printed circuit board section of this specification is not implied. Operation beyond (PCB) design and operating environment. Careful attention to the maximum operating conditions for extended periods may PCB thermal design is required. affect product reliability. THERMAL DATATable 4. Thermal Resistance Package TypeθJAθJC Unit Absolute maximum ratings apply individually only, not in CP-8-27 68.8 10.0 °C/W combination. The ADP7185 can be damaged when the junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature ESD CAUTION limits. In applications with high power dissipation and poor thermal resistance, the maximum ambient temperature may have to be derated. In applications with moderate power dissipation and low printed circuit board (PCB) thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction Rev. 0 | Page 5 of 19 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS INPUT AND OUTPUT CAPACITOR RECOMMENDED SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL DATA THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION ADJUSTABLE MODE OPERATION ENABLE PIN OPERATION START-UP TIME APPLICATIONS INFORMATION ADIsimPOWER DESIGN TOOL CAPACITOR SELECTION Output Capacitor Input Bypass Capacitor CA and CAFB Capacitors Input and Output Capacitor Properties UNDERVOLTAGE LOCKOUT (UVLO) CURRENT-LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
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