ADL5610Data SheetPIN CONFIGURATION AND FUNCTION DESCRIPTIONSRFIN 1ADL5610GND 2TOP VIEW(2) GND(Not to Scale)RFOUT 3NOTES1. THE EXPOSED PAD ENCOMPASSES PIN 2 AND THETAB AT THE TOP SIDE OF THE PACKAGE. SOLDERTHE EXPOSED PAD TO A LOW IMPEDANCE GROUND 002 PLANE FOR ELECTRICAL GROUNDING ANDTHERMAL TRANSFER. 11507- Figure 2. Pin Configuration Table 5. Pin Function Descriptions Pin No.Mnemonic Description 1 RFIN RF Input. This pin requires a dc blocking capacitor. 2 GND Ground. Connect this pin to a low impedance ground plane. 3 RFOUT RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is connected to the external power supply. The RF path requires a dc blocking capacitor. EPAD Exposed Pad. The exposed pad encompasses Pin 2 and the tab at the top side of the package. Solder the exposed pad to a low impedance ground plane for electrical grounding and thermal transfer. Rev. B | Page 8 of 16 Document Outline Features Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters (S-Parameters) Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics 500 MHz to 6 GHz Frequency Band 30 MHz to 500 MHz Frequency Band General Applications Information Basic Connections Soldering Information and Recommended PCB Land Pattern W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide
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