Datasheet ADL5544 (Analog Devices) - 7

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Data Sheet ADL5544 ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
Table 4 lists the junction-to-air thermal resistance (θJA) and the Supply Voltage, VPOS 6.5 V junction-to-case thermal resistance (θJC) for the ADL5544. Input Power (50 Ω Impedance) 18 dBm Internal Power Dissipation 400 mW
Table 4. Thermal Resistance
(Pad Soldered to Ground)
Package Type θ 1 2 JA θJC Unit
Maximum Junction Temperature 150°C 3-Lead SOT-89 (RK-3) 53 15 °C/W Operating Temperature Range −40°C to +105°C 1 Measured on the ADL5544 evaluation board. For more information about Storage Temperature Range −65°C to +150°C board layout, see the Soldering Information and Recommended PCB Land Pattern section. 2 Stresses above those listed under Absolute Maximum Ratings Based on simulation with a standard JEDEC board per JESD51. may cause permanent damage to the device. This is a stress
ESD CAUTION
rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 7 of 20 Document Outline Features Functional Block Diagram General Description Revision History Specifications Typical Scattering Parameters (S-Parameters) Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics 500 MHz to 4 GHz Frequency Band 100 MHz to 500 MHz Frequency Band 4 GHz to 6 GHz Frequency Band General Applications Information Basic Connections Soldering Information and Recommended PCB Land Pattern Operation Down to 30 MHz W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide