Datasheet HMC3653LP3BE (Analog Devices) - 8

HMC3653LP3BE
v02.0917
HBT GAIN BLOCK MMIC AMPLIFIER, 7 - 15 GHz Evaluation PCB
T m s er - w po r & A e lin s - plifier m A
List of Material for Evaluation PCB 113589-HMC3653LP3B- rev D [1]
item Description The circuit board used in the application should J1, J4 pCB mount smA rf Connector use rf circuit design techniques. signal lines C1 - C2 10 pf Capacitor, 0402 pkg. should have 50 ohm impedance while the package C3 - C4 10000 pf Capacitor, 0603 pkg. ground leads and exposed paddle should be con- C5 -C6 4.7 uf Capacitor, Tantalum. nected directly to the ground plane similar to that U1 HmC3653lp3Be shown. A sufficient number of via holes should be pCB [2] 111173-1 evaluation Board used to connect the top and bottom ground planes. 1] reference this number when ordering complete evaluation pCB The evaluation circuit board shown is available from [2] Circuit Board material: rogers 4350 or Arlon 25fr Analog Devices upon request. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Second Harmonics vs. Pout Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Temperature @ Pout = 18 dBm Power Dissipation Power Compression @ 10 GHz Psat vs. Vdd P1dB vs. Vdd Psat vs. Temperature P1dB vs. Temperature Noise Figure vs. Frequency Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Temperature Gain & Return Loss Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit