Datasheet R1525x for Consumer Applications (Ricoh) - 25

POWER DISSIPATION HSOP-6J
Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions Item Measurement Conditions
Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Copper Ratio Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes  0.3 mm × 28 pcs
Measurement Result
(Ta = 25°C, Tjmax = 150°C)
Item Measurement Result
Power Dissipation 3400 mW Thermal Resistance (ja) ja = 37°C/W Thermal Characterization Parameter (ψjt) ψjt = 7°C/W ja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter 4000 3500 3400 3000 (mW) D 2500 n P atio 2000 sip is 1500 er D Pow 1000 500 0 0 25 50 75 100 125 150 Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature Measurement Board Pattern
i