Datasheet Teseo-LIV3R (STMicroelectronics) - 3

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Teseo-LIV3R Contents 9 Geofencing . 16 10 Odometer . 17 11 Regulatory compliance . 18
11.1 CE certification for Teseo-LIV3R . 18
12 Electrical characteristics . 19
12.1 Parameter conditions . 19 12.2 Minimum and maximum values . 19 12.3 Typical values . 19 12.4 Absolute maximum ratings . 19 12.5 Recommended DC operating conditions . 20
13 Mechanical specifications . 21 14 Shipping information . 22
14.1 Reels . 22 14.2 Packing cartons for reels . 24 14.3 ESD handling precautions . 24 14.4 Moisture sensitivity levels . 24
15 Labeling information . 25 16 Reflow soldering profile . 26 17 ECOPACK® . 27 Appendix A Reference document . 28 Revision history . 29
DS12821 Rev 2 3/30 3 Document Outline Table 1. Device summary 1 General description 1.1 GNSS performance Table 2. GNSS performance 1.2 Block diagram Figure 1. Teseo-LIV3R block schematic 1.3 Pin configuration Figure 2. Teseo-LIV3R pin layout 1.4 Pin out description Table 3. Teseo-LIV3R pin out description 2 Supported GNSS constellations 2.1 GPS 2.2 GLONASS 2.3 BeiDou 3 Augmentation systems 3.1 Satellite-Based augmentation system 3.2 QZSS 3.3 Differential GPS Table 4. Supported RTCM message on Teseo-LIV3R 4 Assisted GNSS 4.1 RealTime AGNSS 5 Clock generation 5.1 Temperature-Compensated Crystal Oscillator (TCXO) 5.2 Real Time Clock (RTC) 6 I/O interfaces 6.1 UART 6.2 I2C 7 FW configuration 8 Power mode 8.1 Hardware standby 8.2 Software standby 9 Geofencing 10 Odometer 11 Regulatory compliance 11.1 CE certification for Teseo-LIV3R Figure 3. CE marking 12 Electrical characteristics 12.1 Parameter conditions 12.2 Minimum and maximum values 12.3 Typical values 12.4 Absolute maximum ratings Table 5. Voltage characteristics Table 6. Thermal characteristics Table 7. Power consumption 12.5 Recommended DC operating conditions Table 8. Recommended DC operating conditions 13 Mechanical specifications Figure 4. Teseo-LIV3R mechanical specification 14 Shipping information 14.1 Reels Figure 5. Carrier tape Figure 6. Teseo-LIV3R orientation Figure 7. Cover tape Figure 8. Plastic reel Figure 9. PB band 14.2 Packing cartons for reels 14.3 ESD handling precautions 14.4 Moisture sensitivity levels 15 Labeling information Figure 10. Labeling information of Teseo-LIV3R Table 9. Labeling information description 16 Reflow soldering profile Table 10. Soldering profile values Figure 11. Soldering profiles 17 ECOPACK® Appendix A Reference document Revision history Table 11. Revision history