Data SheetADL5304ABSOLUTE MAXIMUM RATINGS Stresses at or above those listed under Absolute Maximum Table 2. Ratings may cause permanent damage to the product. This is a ParameterRating stress rating only; functional operation of the product at these VPOS +6 V or any other conditions above those indicated in the operational VNEG −6 V section of this specification is not implied. Operation beyond Input Current to INUM, IDEN 20 mA the maximum operating conditions for extended periods may Thermal Data, 2-Layer JEDEC Board No Air affect product reliability. Flow (Exposed Pad Soldered to PCB) θ JA 61.6°C/W θJC 1.2°C/W ESD CAUTION Maximum Power Dissipation (Exposed 0.6 W Pad Soldered to PC Board) Maximum Junction Temperature 125°C Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering 60 sec) 300°C Rev. A | Page 5 of 32 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION SIMPLIFIED BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY THEORY OF OPERATION BASIC CONCEPTS OPTICAL MEASUREMENTS Decibel Scaling CIRCUIT DESCRIPTION Bandwidth vs. Current Noise vs. Current Filtering to Improve Noise and Dynamic Behavior Photodiode Bias Reference Outputs Buffer Amplifier Setting the Log Slope and Intercept Slope Inversion Log Ratio Operation APPLICATIONS INFORMATION USING THE ADL5304 Using the Adaptive Bias Summing Node Voltage Leakage VLOG Output Dynamic Response USING A NEGATIVE SUPPLY EVALUATION BOARD SCHEMATIC AND SILKSCREENS OUTLINE DIMENSIONS ORDERING GUIDE
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