Datasheet AD7291-EP (Analog Devices) - 8

AD7291-EP Enhanced Product OUTLINE DIMENSIONS DETAIL A (JEDEC 95) 4.10 0.30 4.00 SQ 0.25 3.90 PIN 1 0.18 INDICATOR PIN 1 INDIC ATOR AREA OPTIONS 16 20 (SEE DETAIL A) 0.50 1 BSC 15 2.75 EXPOSED 2.60 SQ PAD 2.35 5 11 0.50 10 6 0.25 MIN TOP VIEW BOTTOM VIEW 0.40 0.30 0.80 FOR PROPER CONNECTION OF 0.75 SIDE VIEW THE EXPOSED PAD, REFER TO 0.05 MAX THE PIN CONFIGURATION AND 0.70 0.02 NOM FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COPLANARITY SEATING 0.08 PLANE 0.20 REF B 2017- -005089 21- G K P COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-11. 02-
Figure 5. 20-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 0.75 mm Package Height (CP-20-8) Dimensions shown in millimeters
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
AD7291TCPZ-EP −55°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP] CP-20-8 AD7291TCPZ-EP-RL7 −55°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP] CP-20-8 1 Z = RoHS Compliant Part. I2C refers to a communications protocol original y developed by Philips Semiconductors (now NXP Semiconductors).
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Rev. 0 | Page 8 of 8 Document Outline FEATURES ENHANCED PRODUCT FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE