Datasheet AD7924-KGD (Analog Devices) - 8

AD7924-KGD Known Good Die OUTLINE DIMENSIONS 0.500 2.300 24 1 23 22 2 21 3 20 4 19 2.620 5 18 6 17 7 16 8 9 10 11 12 13 14 15 TOP VIEW SIDE VIEW (CIRCUIT SIDE) A 0.092 × 0.092 11- 20 12- 09-
Figure 4. 24-Pad Bare Die [CHIP] (C-24-1) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Chip Size 2180 (x) × 2450 (y) µm Scribe Line Width 120 (x) × 170 (y) µm Die Size 2300 (x) × 2620 (y) µm Thickness 500 µm Backside Silicon Not applicable Passivation Nitride Not applicable Bond Pads (Minimum) 92 × 92 µm Bond Pad Composition 99.5% Al, 0.5% Cu % ESD 1.5 kV
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach No special recommendations Bonding Method Gold ball or aluminum wedge Bonding Sequence 9 and 10
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD7924-KGD-DF −40°C to +85°C 24-Pad Bare Die [CHIP] C-24-1
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Rev. A | Page 8 of 8 Document Outline FEATURES GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE