Datasheet AD8512-EP (Analog Devices) - 5

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Enhanced Product AD8512-EP ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage ±18 V (PCB) design and operating environment. Careful attention to Input Voltage ±V PCB thermal design is required. S Power Dissipation See Figure 2 θJA is the natural convection junction to ambient thermal Storage Temperature Range −65°C to +150°C resistance measured in a one cubic foot sealed enclosure. θJC is Operating Temperature Range −55°C to +125°C the junction to case thermal resistance. Junction Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 sec) 300°C
Table 4. Thermal Resistance
Electrostatic Discharge 2000 V
Package Type
1
θJA θJC Unit
(Human Body Model) R-8 158 43 °C/W Stresses at or above those listed under Absolute Maximum 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal Ratings may cause permanent damage to the product. This is a test board. See JEDEC JESD-51. stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
1.0
section of this specification is not implied. Operation beyond
0.9
the maximum operating conditions for extended periods may
) (W 0.8 V
affect product reliability.
N SY = ±15V IO T 0.7 PA 0.6 ISSI D 0.5 ER W 0.4 M PO 0.3 VSY = ±5V MU XI 0.2 MA 0.1 0 –55 –35 –15 5 25 45 65 85 105 125
040
AMBIENT TEMPERATURE (°C)
17170- Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. 0 | Page 5 of 7 Document Outline Features Enhanced Product Features Applications Pin Configuration General Description Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Outline Dimensions Ordering Guide