ADL5246Data SheetABSOLUTE MAXIMUM RATINGS Table 2.THERMAL RESISTANCEParameterRating θJA is specified for a ADL5246 soldered to the evaluation board, Supply Voltage, VPOS 5.5 V a 4-layer circuit board with a 5 × 5 thermal via array under the Maximum RF Input Level (AMP1) 20 dBm exposed paddle. θJA measured at the top of the package. θJC Internal Power Dissipation 3 W derived using a JEDEC test board. Maximum Junction Temperature 150°C Operating Temperature Range –40°C to +105°C Table 3. Thermal Resistance Storage Temperature Range –65°C to +150°C Package TypeθJAθJCUnit Lead Temperature Range (Soldering 30 sec) 250°C 32-Lead LFCSP 16.5 1.15 °C/W Human Body Model (HBM) ESD Rating ±1.0 kV (ESDA/JEDEC JS-001-2011) ESD CAUTION Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 8 of 36 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY THEORY OF OPERATION BASIC CONNECTIONS Amplifier 1 (AMP1) Amplifier 2 (AMP2) Amplifier 3 (AMP3) Gain Control Amplifier 3 Matching ERROR VECTOR MAGNITUDE (EVM) PERFORMANCE THERMAL INFORMATION AND RECOMMENDED PCB LAND PATTERN FULL CHAIN OPERATION CONSIDERATIONS EVALUATION BOARD CHARACTERIZATION INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE
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