HMC1023LP5E v01.0113 72 MHz DUAL PROGRAMMABLELOW PASS FILTER WITH DRIVEROutline Drawing T M G - S IN S S E C O R NOTES: [1] PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC D P SILICA AND SILICON IMPREGNATED. [2] LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY. N [3] LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN. [4] DIMENSIONS ARE IN INCHES [MILLIMETERS]. A [5] LEAD SPACING TOLERANCE IS NON-CUMULATIVE. [6] PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL B BE 0.25m MAX. E [7] PACKAGE WARP SHALL NOT EXCEED 0.05mm [8] ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO S PCB RF GOUND. [9] REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND A PATTERN. Table 5. Package Information IF / B Part Number Package Body Material Lead Finish MSL Rating [1] Package Marking [2] H1023 HMC1023LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com 10 Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 p o lica rti a o p n S p u s p @ po h rt itt : P ite ho . n c e om : 1-800-ANALOG-D
