Datasheet HMC8121 (Analog Devices) - 8

HMC8121 Data Sheet 0 0 VCTLx = –5.0V VCTLx = –2.6V VCTLx = –1.2V VCTLx = –5.0V VCTLx = –2.6V VCTLx = –1.2V VCTLx = –4.0V VCTLx = –2.2V VCTLx = –1.0V VCTLx = –4.0V VCTLx = –2.2V VCTLx = –1.0V VCTLx = –3.5V VCTLx = –2.0V VCTLx = –3.5V VCTLx = –2.0V –5 VCTLx = –3.0V VCTLx = –1.5V –4 VCTLx = –3.0V VCTLx = –1.5V ) B) –10 B d –8 ( (d S S S S O O –15 L –12 N L UR URN T T –20 RE –16 RE –25 –20 –30
7
–24
0
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
01
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
02
FREQUENCY (GHz)
154-
FREQUENCY (GHz)
154- 13 13 Figure 17. Input Return Loss vs. Frequency at Various Control Voltages Figure 20. Output Return Loss vs. Frequency at Various Control Voltages
–40 30 TA = –55°C TA = +25°C T 29 A = +85°C –45 28 27 ) –50 dB ( ) 26 m ON B –55 d TI 25 A 3 ( IP 24 ISOL –60 23 22 –65 T 21 A = –55°C TA = +25°C TA = +85°C –70 20
9
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
033
81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
01 54-
FREQUENCY (GHz) FREQUENCY (GHz)
154- 131 13 Figure 18. Reverse Isolation vs. Frequency at Various Temperatures, Figure 21. Output IP3 vs. Frequency at Various Temperatures, VCTL1/VCTL2 = −5 V PIN = −10 dBm/Tone, VCTL1/VCTL2 = −5 V
25 25 TA = –55°C TA = –55°C 24 TA = +25°C 24 TA = +25°C TA = +85°C TA = +85°C 23 23 22 22 ) 21 ) m 21 m B B (d 20 (d 20 B T d SA P1 19 P 19 18 18 17 17 16 16 15 15 81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0 81.0 81.5 82.0 82.5 83.0 83.5 84.0 84.5 85.0 85.5 86.0
-018 021 54-
FREQUENCY (GHz) FREQUENCY (GHz)
13154 131 Figure 19. Output P1dB vs. Frequency at Various Temperatures, Figure 22. PSAT vs. Frequency at Various Temperatures, VCTL1/VCTL2 = −5 V VCTL1/VCTL2 = −5 V Rev. B | Page 8 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE