Datasheet HMC8120 (Analog Devices) - 14

HMC8120 Data Sheet ASSEMBLY DIAGRAM 50Ω TRANSMISSION LINE 3mil WIDE 3mil GOLD RIBBON NOMINAL (WEDGE BOND) GAP 1 2 3 HMC8120 IN RF 4 RFOUT 5 1.6kΩ 1.6kΩ 6 3mil WIDE GOLD RIBBON (WEDGE BOND) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 1 2 T 1 2 3 4 5 6 L L F T GG2 DD DD DE CT CT GG3 DD GG4 DD GG5 DD GG6 DD RE DE /V V V V V V V V V V V V V V V V EN GG1V 120pF 0.01µF 4.7µF 4.7µF 4.7µF 4.7µF 4.7µF 4.7µF 4.7µF
6 03 0-
VGG1/VGG2 V V DD1, VDD2 VCTL1, VCTL2 GG3, VGG4 V V DD3, VDD4, VDD5 VGG5, VGG6 DD6
315 1 Figure 39. Assembly Diagram Rev. A | Page 14 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE