Datasheet HMC8120 (Analog Devices) - 7

Data Sheet HMC8120 TYPICAL PERFORMANCE CHARACTERISTICS 30 30 TA = –55°C 25 T 28 A = +25°C TA = +85°C 20 26 15 24 B) d 10 ( ) 22 E B GAIN d NS 5 INPUT RETURN LOSS ( 20 O IN P OUTPUT RETURN LOSS S 0 GA 18 RE –5 16 –10 14 –15 12 –20
1
10 69 70 71 72 73 74 75 76 77 78
1 -0
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
014 0-
FREQUENCY (GHz) FREQUENCY (GHz)
13150 1315 Figure 11. Broadband Gain and Return Loss Response vs. Frequency, Figure 14. Gain vs. Frequency at Various Temperatures, VCTL1/VCTL2 = −5 V VCTL1/VCTL2 = −5 V
30 30 RF = 71GHz RF = 72GHz RF = 73GHz 25 25 RF = 74GHz RF = 75GHz RF = 76GHz 20 20 ) ) B B d d ( ( 15 15 IN IN A G GA 10 10 5 VCTLx = –5.0V VCTLx = –2.6V VCTLx = –1.2V 5 VCTLx = –4.0V VCTLx = –2.2V VCTLx = –1.0V VCTLx = –3.5V VCTLx = –2.0V VCTLx = –3.0V VCTLx = –1.5V 0 0
2
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
01
–5.0 –4.5 –4.0 –3.5 –3.0 –2.5 –2.0 –1.5 –1.0
015 50-
FREQUENCY (GHz)
150-
CONTROL VOLTAGE (V)
13 131 Figure 12. Gain vs. Frequency at Various Control Voltages Figure 15. Gain vs. Control Voltage at Various RF Frequencies
0 0 TA = –55°C TA = –55°C –2 TA = +25°C –2 TA = +25°C TA = +85°C TA = +85°C –4 –4 ) –6 ) –6 B B d d ( ( S –8 S –8 S S O O L –10 L –10 RN RN U –12 U T –12 T RE –14 RE –14 –16 –16 –18 –18 –20 –20 71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
013
71.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0
016 0- 0-
FREQUENCY (GHz) FREQUENCY (GHz)
1315 1315 Figure 13. Input Return Loss vs. Frequency at Various Temperatures, Figure 16. Output Return Loss vs. Frequency at Various Temperatures, VCTL1/VCTL2 = −5 V VCTL1/VCTL2 = −5 V Rev. A | Page 7 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE