MAAM-011275-DIEWideband Distributed Amplifier30 kHz - 40 GHzRev. V1Die Dimensions9,10,11 9. All units in µm, unless otherwise noted, with a tolerance of ±5 µm. 10. Die thickness is 50 ±5 µm. 11. Die size reflects un-cut dimensions. Laser kerf reduces die size by ~ 25 µm each dimension. Bond Pad Detail 1,3,5,7 74 89 2, 6, 74 140 3,13,14,16 76 76 8,9,10,11 96 96 12 76 71 15 71 76 9 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0018857
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