LT3462/LT3462A PACKAGE DESCRIPTIONPlease refer to http://www.linear.com/product/LT3462#packaging for the most recent package drawings.DC8 Package8-Lead Plastic DFN (2mm × 2mm) (Reference LTC DWG # 05-08-1719 Rev A) 0.70 ±0.05 2.55 ±0.05 0.64 ±0.05 1.15 ±0.05 (2 SIDES) PACKAGE OUTLINE 0.25 ±0.05 0.45 BSC 1.37 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 TYP R = 0.05 5 8 TYP 0.40 ±0.10 2.00 ±0.10 0.64 ±0.10 PIN 1 NOTCH (4 SIDES) (2 SIDES) PIN 1 BAR R = 0.20 OR TOP MARK 0.25 × 45° (SEE NOTE 6) CHAMFER (DC8) DFN 0409 REVA 4 1 0.23 ±0.05 0.200 REF 0.75 ±0.05 0.45 BSC 1.37 ±0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE Rev A For more information www.analog.com 9 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
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