Datasheet LTC3376 (Analog Devices) - 5

link to page 2 LTC3376
ELECTRICAL CHARACTERISTICS Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 3:
There will be additional switching current on VINA-H pins. may cause permanent damage to the device. Exposure to any Absolute
Note 4:
Total System current is defined as total current from VCC + VINA-H Maximum Rating condition for extended periods may affect device when all bucks are on (in Sleep), VCC = VINA-H = 12V, and EXTVCC is boot- reliability and lifetime. strapped to run off of a 3.3V buck.
Note 2:
The LTC3376 is tested under pulsed load conditions such
Note 5:
The current limit features of this part are intended to protect the that TJ ~ TA. The LTC3376E is guaranteed to meet specifications from IC from short term or intermittent fault conditions. Continuous operation 0°C to 85°C junction temperature. Specifications over the –40°C to above the specified maximum pin current rating may result in device 125°C operating junction temperature range are assured by design, degradation over time. characterization and correlation with statistical process controls. The
Note 6:
The Soft-Start Time is the time from the start of switching until LTC3376I is guaranteed over the –40°C to 125°C operating junction V + – V – reaches 360mV. temperature range. High junction temperatures degrade operating FB FB lifetimes; operating lifetime is derated for junction temperatures greater
Note 7:
The LTC3376 includes overtemperature protection which protects than 125°C. Note that the maximum ambient temperature consistent the device during momentary overload conditions. Junction temperature with these specifications is determined by specific operating conditions exceeds the maximum operating junction temperature when overtemperature in conjunction with board layout, the rated package thermal impedance protection is active. Continuous operation above the specified maximum and other environmental factors. The junction temperature (T operating junction temperature may impair device reliability. J in °C) is calculated from ambient temperature (TA in °C) and power dissipation (PD in Watts) according to the formula: TJ = TA + (PD • θJA) where θJA (in °C/W) is the package thermal impedance. Rev 0 For more information www.analog.com 5 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Typical Application Related Parts