Клеммные колодки Keen Side

Datasheet ICM7555 (NXP) - 7

ПроизводительNXP
ОписаниеGeneral purpose CMOS timer
Страниц / Страница22 / 7 — NXP Semiconductors. ICM7555. General purpose CMOS timer. Fig 7. Low …
Формат / Размер файлаPDF / 125 Кб
Язык документаанглийский

NXP Semiconductors. ICM7555. General purpose CMOS timer. Fig 7. Low output voltage versus output sink current. Product data sheet

NXP Semiconductors ICM7555 General purpose CMOS timer Fig 7 Low output voltage versus output sink current Product data sheet

12 предложений от 12 поставщиков
Микросхема Усилитель звуковой частоты, Standard Timer Single -40℃ 85℃ Automotive 8Pin PDIP Bulk
ChipWorker
Весь мир
ICM7555IN/01,112
NXP
59 ₽
EIS Components
Весь мир
ICM7555IN/01,112
65 ₽
Lixinc Electronics
Весь мир
ICM7555IN/01,112
NXP
по запросу
IC Home
Весь мир
ICM7555IN/01,112
NXP
по запросу

Модельный ряд для этого даташита

Текстовая версия документа

NXP Semiconductors ICM7555 General purpose CMOS timer
002aae407 102 Io(sink) VDD = 18 V (mA) 5 V 2 V 10 1 10−1 10−1 1 10 VOL (V) a. Tamb = +125 °C. 002aae408 102 Io(sink) VDD = 18 V (mA) 5 V 2 V 10 1 10−1 10−1 1 10 VOL (V) b. Tamb = +25 °C. 002aae409 102 VDD = 18 V Io(sink) 5 V (mA) 2 V 10 1 10−1 10−1 1 10 VOL (V) c. Tamb = −55 °C.
Fig 7. Low output voltage versus output sink current
ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 7 of 22
Document Outline 1. General description 2. Features 3. Applications 4. Ordering information 5. Functional diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Function selection 8. Limiting values 9. Characteristics 10. Typical performance curves 11. Application information 11.1 General 11.2 Power supply considerations 11.3 Output drive capability 11.4 Astable operation 11.5 Monostable operation 11.6 Control voltage 11.7 RESET 12. Package outline 13. Soldering of SMD packages 13.1 Introduction to soldering 13.2 Wave and reflow soldering 13.3 Wave soldering 13.4 Reflow soldering 14. Soldering of through-hole mount packages 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Abbreviations 16. Revision history 17. Legal information 17.1 Data sheet status 17.2 Definitions 17.3 Disclaimers 17.4 Trademarks 18. Contact information 19. Contents
ТМ Электроникс. Электронные компоненты и приборы. Скидки, кэшбэк и бесплатная доставка