Источники питания Keen Side

Datasheet ICM7555 (NXP) - 10

ПроизводительNXP
ОписаниеGeneral purpose CMOS timer
Страниц / Страница22 / 10 — NXP Semiconductors. ICM7555. General purpose CMOS timer
Формат / Размер файлаPDF / 125 Кб
Язык документаанглийский

NXP Semiconductors. ICM7555. General purpose CMOS timer

NXP Semiconductors ICM7555 General purpose CMOS timer

8 предложений от 8 поставщиков
Микросхема Таймер, Standard Timer Single -40℃ 85℃ Automotive 8Pin SO Bulk
ChipWorker
Весь мир
ICM7555ID/DG,112
NXP
19 ₽
ЧипСити
Россия
ICM7555ID/DG,112
NXP
49 ₽
AiPCBA
Весь мир
ICM7555ID/DG,112
NXP
52 ₽
EIS Components
Весь мир
ICM7555ID/DG,112
63 ₽
Новое семейство LED-драйверов XLC компании MEAN WELL с дополнительными возможностями диммирования

Модельный ряд для этого даташита

Текстовая версия документа

NXP Semiconductors ICM7555 General purpose CMOS timer
002aae415 102 C (µF) 10 1 10−1 10−2 1 kΩ 10−3 10 kΩ 100 kΩ 1 MΩ 10−4 10 MΩ 10−5 10−1 1 106 105 104 103 102 10 107 f (Hz) VDD = 5 V; Tamb = +25 °C
Fig 12. Free-running frequency as a function of RA, RB resistance and external capacitance
002aae416 102 C (µF) 10 1 kΩ 10 kΩ 1 100 kΩ 1 MΩ 10 MΩ 10−1 10−2 10−3 10−4 10−5 10−7 10−1 10−2 10−3 10−4 10−5 10−6 1 10 td (s) VDD = 5 V; Tamb = +25 °C
Fig 13. Monostable time delay versus RA resistance and external capacitance
ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 10 of 22
Document Outline 1. General description 2. Features 3. Applications 4. Ordering information 5. Functional diagram 6. Pinning information 6.1 Pinning 6.2 Pin description 7. Functional description 7.1 Function selection 8. Limiting values 9. Characteristics 10. Typical performance curves 11. Application information 11.1 General 11.2 Power supply considerations 11.3 Output drive capability 11.4 Astable operation 11.5 Monostable operation 11.6 Control voltage 11.7 RESET 12. Package outline 13. Soldering of SMD packages 13.1 Introduction to soldering 13.2 Wave and reflow soldering 13.3 Wave soldering 13.4 Reflow soldering 14. Soldering of through-hole mount packages 14.1 Introduction to soldering through-hole mount packages 14.2 Soldering by dipping or by solder wave 14.3 Manual soldering 14.4 Package related soldering information 15. Abbreviations 16. Revision history 17. Legal information 17.1 Data sheet status 17.2 Definitions 17.3 Disclaimers 17.4 Trademarks 18. Contact information 19. Contents
ТМ Электроникс. Электронные компоненты и приборы. Скидки, кэшбэк и бесплатная доставка