ADA4558Data SheetABSOLUTE MAXIMUM RATINGS Table 2.THERMAL RESISTANCEParameter Rating Thermal performance is directly linked to printed circuit VDD12 40 V board (PCB) design and operating environment. Close LIN 40 V attention to PCB thermal design is required. Reverse Protection θJA is the natural convection junction to ambient thermal VDD12 AGND to −0.3 V resistance measured in a one cubic foot sealed enclosure. θJC is LIN −40 V the junction to case thermal resistance. VREG, VPOS, VNEG, TPOS, TNEG, ISINK, −0.3 V to +6 V RREFN Table 3. Thermal Resistance LIN Short-Circuit Duration to LINGND or Indefinite Package TypeθJAθJC Unit VDD12 CP-20-81 49 1.42 °C/W ESD Human Body Model (All Pins) 4000 V 1 Test Condition 1: Thermal impedance simulated values are based on JEDEC 4-layer test board. LIN and LIN2 Pins 6000 V Charged Device Model 1000 V Machine Model 200 V ESD CAUTION LIN, LIN2 ESD (IEC 61000-4-2) >8 kV contact Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +150°C Junction Temperature Range −40°C to +165°C Soldering Profile IPC/JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 6 of 12 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL CONNECTION DIAGRAM EMC PERFORMANCE PCB LAYOUT GUIDELINES OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS
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