Datasheet DA9217 (Dialog Semiconductor) - 9

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DA9217 High-Performance Dual-Phase DC-DC Converter 3.3 Thermal Characteristics 3.3.1 Thermal Ratings Table 5: Package Ratings Parameter Description Conditions Min Typ Max Unit
JA Package thermal resistance 32.7 °C/W Note 1
Note 1
Obtained from package thermal simulation, 2S2P4L board (JEDEC), influenced by PCB technology and layout.
3.3.2 Power Dissipation Table 6: Power Dissipation Parameter Description Conditions Min Typ Max Unit
Derating factor above T P A = D Power dissipation 2140 mW 70°C : 30.6 mW/°C (1/θJA) 4.0 3.5
P = (T - T ) / θ D J A JA θ = 32.7 °C/W JA Still air (0 m/s)
3.0
▲T = 125 °C J(WARN)
◆
T = 140 °C J(CRIT)
2.5
) W(
2.0
DP
1.5 1.0 0.5 0.0 20 30 40 50 60 70 80 90 100 110 120 130 140
T (°C) A Figure 5: 24WLCSP Power Derating Curve 3.4 ESD Characteristics Table 7: ESD Characteristics Parameter Description Conditions Min Typ Max Unit
ESD protection, human VESD_HBM 2 kV body model (HBM)
Datasheet Revision 2.0 18-Jul-2019
CFR0011-120-00 9 of 47 © 2019 Dialog Semiconductor Document Outline General Description Key Features Applications System Diagrams Contents 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital IO Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 WLCSP Handling 6.4 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection