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Datasheet DA9220 (Dialog Semiconductor) - 4

ПроизводительDialog Semiconductor
ОписаниеHigh-Performance Dual-Channel DC-DC Converter
Страниц / Страница61 / 4 — DA9220. High-Performance Dual-Channel DC-DC Converter. 6 Package …
Формат / Размер файлаPDF / 1.5 Мб
Язык документаанглийский

DA9220. High-Performance Dual-Channel DC-DC Converter. 6 Package Information ... 57. 7 Ordering Information .. 59

DA9220 High-Performance Dual-Channel DC-DC Converter 6 Package Information .. 57 7 Ordering Information . 59

2-Channel High-Performance DC to DC Converter Buck 1.2V/1.8V 3A 24-Pin WLCSP Tray
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DA9220-70V76
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DA9220 High-Performance Dual-Channel DC-DC Converter
5.1.4 Serialization ... 56
6 Package Information ... 57
6.1 Package Outlines .. 57 6.2 Moisture Sensitivity Level.. 58 6.3 WLCSP Handling .. 58 6.4 Soldering Information .. 58
7 Ordering Information .. 59 8 Application Information .. 59
8.1 Capacitor Selection ... 59 8.2 Inductor Selection ... 60
Datasheet Revision 2.0 18-Jul-2019
CFR0011-120-00 4 of 61 © 2019 Dialog Semiconductor Document Outline General Description Key Features Applications System Diagrams Contents 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital I/O Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Buck2 5.1.4 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 WLCSP Handling 6.4 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection
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