Datasheet HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, HCPL-0201, HCPL-0211, HCNW2201, HCNW2211 (Avago Technologies) - 7

HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, HCPL-0201, HCPL-0211, HCNW2201, HCNW2211
Data Sheet Very High CMR, Wide VCC Logic Gate Optocouplers
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11) 11.23 ± 0.15 (0.442 ± 0.006) LAND PATTERN RECOMMENDATION 8 7 6 5 9.00 ± 0.15 (0.354 ± 0.006) 13.56 (0.534) 1 2 3 4 1.3 2.29 (0.051) (0.09) 1.55 12.30 ± 0.30 (0.061) (0.484 ± 0.012) MAX. 11.00 (0.433) MAX. 4.00 (0.158) MAX. 1.80 ± 0.15 (0.071 ± 0.006) 1.00 ± 0.15 0.75 ± 0.25 (0.039 ± 0.006) 2.54 (0.030 ± 0.010) 0.254 + 0.076 (0.100) - 0.0051 BSC (0.010 + 0.003) - 0.002) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). 7
°
NOM. NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Broadcom AV02-0674EN 7 Document Outline Description Features Applications Functional Diagram Selection Guide Schematic Ordering Information Package Outline Drawings 8-Pin DIP Package (HCPL-2201/02/11/12/31/32) 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2201/02/11/12/31/32) Small-Outline SO-8 Package (HCPL-0201/11) 8-Pin Widebody DIP Package (HCNW2201/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11) Solder Reflow Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (Option 060) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW22xx Option 060 ONLY) Absolute Maximum Ratings Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics