TB67S158FTG 3-1. Application Notes 1) All the grounding wires of the device must run on the solder mask on the PCB and be externally terminated at only one point. Also, a grounding method should be considered for efficient heat dissipation. 2) When setting pin of each mode is controlled by SW, the voltage should be pull-up to the power supply which is the same voltage of the input signal or pull-down to the GND in order to avoid Hi-Z. 3) Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently damaged. 4) Also, the utmost care should be taken for pattern designing and implementation of the device since it has power supply pins (VM, OUT, GND, etc.) through which a particularly large current may run. If these pins are wired incorrectly, an operation error may occur or the device may be destroyed. The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current running through the IC that is larger than the specified current. 4 2015-3-3
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