TB67B000HG Pin Assignment IS3 VBB W BSV BSU IS1 PGND BSW V U IS2 Vreg 30 29 28 27 26 25 24 23 22 21 20 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FG LA OSCR HUP HVP HWP FGC Vrefout CW/CCW VSP SGND TR HUM HVM HWM SS Idc VCC Note: Die pad on surface and PGND is connected. When using the heat sink, handle it not to short with the IC therminals. When applying the different potential with GND level to the heat sink, insulate with die pad and the heat sink. 3 2013-5-9 Document Outline TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP) Features Block Diagram Pin Assignment Pin Description Absolute Maximum Ratings (Ta = 25°C) Operating conditions (Ta = 25°C) Package Power Dissipation Electrical Characteristics (Ta = 25°C) Functional Description Timing Chart of FG Signal Timing Chart 1: Output waveform of sine-wave PWM drive Timing Chart 2: Output waveform of sine-wave PWM drive Timing Chart 3: Output waveform of wide-angle commutation Timing Chart 4: Output waveform of wide-angle commutation Timing Chart 5: Output waveform of square-wave drive Timing Chart 6: Output waveform of square-wave drive Timing Chart 7: Output waveform of square-wave drive Timing Chart 8: Output waveform of square-wave drive Application Circuit External Parts Package Dimensions
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