Datasheet MIC920 (Microchip) - 6

MIC920 2.0 TYPICAL PERFORMANCE CURVES Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 1.25 2.2 2 ) Vr = r2.5V 1.2 ) V Vr = r2.5V V 1.8 m( m( 1.15 1.6 –40 E E qC G G 1.4 A 1.1 A T Vr = r5V T L 1.2 L O O 1 +25qC V 1.05 V T Vr = r9V T 0.8 E 1 E S S 0.6 F F F F 0.4 O 0.95 O 0.2 +85qC 0.9 0 -40 -20 0 20 40 60 80 100 -900 -540 -180 180 540 900 TEMPERATURE (qC) COMMON-MODE VOLTAGE (V)
FIGURE 2-1:
Offset Voltage vs.
FIGURE 2-4:
Offset Voltage vs. Temperature. Common-Mode Voltage. 2.2 0.60 Vr = r9V 2 ) Vr = r5V ) V A 0.55 1.8 Vr = r5V m m ( 1.6 E T 0.50 N G 1.4 E A Vr = r2.5V T 1.2 R L –40qC R 0.45 O 1 U V +25qC C T 0.8 Y 0.40 E L S 0.6 P F P F 0.4 +85qC U 0.35 O S 0.2 0 0.30 0 2 4 6 8 0 8 6 4 2 0 -40 -20 0 20 40 60 80 100 4. 7. 0. 3. 6. 6. 3. 0. 7. 4. 0 1 2 2 3 TEMPERATURE (qC) 3- 2- 2- 1- 0- COMMON-MODE VOLTAGE (V)
FIGURE 2-2:
Supply Current vs.
FIGURE 2-5:
Offset Voltage vs. Temperature. Common-Mode Voltage. 2.2 0.62 2 Vr = r9V ) 0.60 ) V 1.8 A 0.58 m( m 1.6 ( E 0.56 T G 1.4 N 0.54 A E +85qC T 1.2 R L –40qC 0.52 R O 1 U V 0.50 +25qC C +25qC T 0.8 E Y 0.48 L S 0.6 P 0.46 F F P 0.4 +85qC U 0.44 –40qC O S 0.2 0.42 0 0 2 4 6 8 0 8 6 4 2 0 0.40 4 9 4 9 4 4 9 4 9 4 2.5 3.8 5.1 6.4 7.7 9 . 7- 5- 4- 2- 1- 1 2 4 5 7 SUPPLY VOLTAGE (V) COMMON-MODE VOLTAGE (V)
FIGURE 2-6:
Offset Voltage vs.
FIGURE 2-3:
Supply Current vs. Supply Common-Mode Voltage. Voltage. DS20006268A-page 6  2019 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves 3.0 Test Circuits 4.0 Pin Descriptions 5.0 Application Information 5.1 Driving High Capacitance 5.2 Feedback Resistor Selection 5.3 Layout Considerations 5.4 Power Supply Bypassing 5.5 Thermal Considerations 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service