Datasheet BTA24, BTB24, BTA25 BTA26, BTB26, T25 (STMicroelectronics) - 7

BTA24, BTB24, BTA25, BTA26, BTB26, T25 Package information 3 Package information
● Epoxy meets UL94,V0 ● Cooling method: C ● Recommended torque value: 0.4 - 0.5 Nm (TO-220AB), 0.9 - 1.2 Nm (TOP3 and RD91) ● Maximum torque value for BTB24 is 0.5 Nm
Table 7. D2PAK dimensions DIMENSIONS REF. Millimeters Inches Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.169 0.181
A E
A1 2.49 2.69 0.098 0.106
C2 L2
A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037
D L
B2 1.25 1.40 0.048 0.055
L3
C 0.45 0.60 0.017 0.024
A1 B2
C2 1.21 1.36 0.047 0.054
C R B
D 8.95 9.35 0.352 0.368
G
E 10.00 10.28 0.393 0.405
A2 2mm min.
G 4.88 5.28 0.192 0.208
FLAT ZONE
L 15.00 15.85 0.590 0.624
V2
L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 R 0.40 0.016 V2 0° 8° 0° 8°
Figure 14. D2PAK footprint dimensions (in millimeters)
16.90 10.30 5.08 1.30 3.70 8.90 7/12 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute maximum ratings Table 3. Electrical characteristics (Tj = 25˚ C, unless otherwise specified), Snubberless and logic level (3 quadrants) T25, BTA/BTB24...W, BTA25...W, BTA26...W Table 4. Electrical characteristics (Tj = 25˚ C, unless otherwise specified), standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B, BTB26...B Table 5. Static characteristics Table 6. Thermal resistance Figure 1. Maximum power dissipation versus RMS on-state current (full cycle) Figure 2. RMS on-state current versus case temperature (full cycle) Figure 3. D2PAK RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle) Figure 4. Relative variation of thermal impedance versus pulse duration Figure 5. On-state characteristics (maximum values) Figure 6. Surge peak on-state current versus number of cycles Figure 7. Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t Figure 8. Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) Figure 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) Figure 10. Relative variation of critical rate of decrease of main current versus Tj Figure 11. D2PAK thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm) 2 Ordering information scheme Figure 12. BTA and BTB series Figure 13. T25 series 3 Package information Table 7. D2PAK dimensions Figure 14. D2PAK footprint dimensions (in millimeters) Table 8. RD91 dimensions Table 9. TOP3 (insulated and non_insulated) dimensions Table 10. TO-220AB (insulated and non-insulated) dimensions 4 Ordering information Table 11. Ordering information 5 Revision history Table 12. Revision history