1 N 4 7Top Mark Information (Continued) 2 8 A - 1st line: F - ON Semiconductor Logo 1N47 2nd line: Device Name - 3rd to 4th characters of device name for 1Nxx series 4 or 4th to 6th characters for BZXyy series 7 536 3rd line: Device Name - 5th to 6th characters of device name for 1Nxx series 8 or Voltage rating for BZXyy series AA 4th line: Device Name - 7th to 8th characters of device name for 1Nxx series — or Large Die identification only for BZXyy series XYZ 5th line: Date Code - Two Digit - Six Weeks Date Code e n e r DGeneral Requirements:io d 1.0 Cathode Band e s 2.0 First Line: - ON Semiconductor Logo 3.0 Second Line: Device name - For 1Nxx series: 3rd to 4th characters of the device name. For BZxx series: 4th to 6th characters of the device name. 4.0 Third Line: Device name - For 1Nxx series: 5th to 6th characters of the device name. For BZXyy series: Voltage rating 5.0 Third Line: Device name - For 1Nxx series: 7th to 8th characters of the device name. (the 8th character is the large die identification) For BZXyy series: Large Die Identification character 6.0 Fourth Line: Date Code - Two Digit - Six Weeks Date Code Where: X represents the last digit of the calendar year Y represents the Six weeks numeric code 7.0 Devices shall be marked as required in the device specification (PID or ON Semiconductor Test Spec). 8.0 Maximum no. of marking lines: 5 9.0 Maximum no. of digits per line: 3 10.0 ON Semiconductor logo must be 20 % taller than the alphanumeric marking and should occupy the 2 characters of the specified line. 11.0 Marking Font: Arial (Except ON Semiconductor Logo) 12.0 First character of each marking line must be aligned vertically. 13.0 All device markings must be based on ON Semiconductor device specification. www.onsemi.com 3
