Data SheetAD8216PIN CONFIGURATION AND FUNCTION DESCRIPTIONS18–IN18+IN72GND2AD82167VREF16VREF2 36TOP VIEWV+(Not to Scale)NC45OUT35 002 003 NC = NO CONNECT 07062- 07062- Figure 2. Metallization Diagram Figure 3. Pin Configuration Table 3. Pin Function Descriptions Pin No.MnemonicXY 1 −IN −320 +390 2 GND −357 +14 3 VREF2 −349 −201 4 NC NC NC 5 OUT +348 −325 6 V+ +349 −194 7 VREF1 +349 −26 8 +IN +318 +390 Die size is 1100 µm by 1035 µm. Die thickness is 13 mil. Minimum passivation opening (minimum bond pad size) is 92 µm × 92 µm. Passivation type is 8 kA USG (Oxide) + 10 kA Oxynitride. Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu. Backside potential is V+. Rev. C | Page 5 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION OUTPUT OFFSET ADJUSTMENT UNIDIRECTIONAL OPERATION GROUND REFERENCED OUTPUT V+ REFERENCED OUTPUT BIDIRECTIONAL OPERATION EXTERNAL REFERENCED OUTPUT SPLITTING THE SUPPLY SPLITTING AN EXTERNAL REFERENCE APPLICATIONS INFORMATION HIGH-SIDE CURRENT SENSE WITH A LOW-SIDE SWITCH HIGH-SIDE CURRENT SENSE WITH A HIGH-SIDE SWITCH OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS
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