Datasheet AD8202-KGD (Analog Devices) - 6

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AD8202-KGD Known Good Die OUTLINE DIMENSIONS 0.391 0.381 0.371 1.180 1 8 2 7 1.165 6 3 4 5 A TOP VIEW SIDE VIEW (CIRCUIT SIDE) 0.092 × 0.092 2012- 22- 02-
Figure 3. 8-Pad Bare Die [CHIP] (C-8-1) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 4. Die Specifications Parameter Value Unit1
Chip Size 1090 × 1105 μm Scribe Line Width 75 × 75 μm Die Size 1.180 × 1.165 mm (maximum) Thickness 381 ± 10 μm Bond Pad 92 × 92 μm (minimum) Bond Pad Composition 0.5 AlCu % Backside Bare N/A Passivation Polymide N/A 1 N/A means not applicable.
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach No special requirements Bonding Method Gold ball or aluminum wedge Bonding Sequence Any
ORDERING GUIDE Model1 Temperature Range Package Option
AD8202W-KGD-R7 −40°C to +150°C C-8-1 1 W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The AD8202W model is available with control ed manufacturing to support the quality and reliability requirements of automotive applications. Note that this automotive model may have specifications that differ from the commercial models; therefore, designers should review the Specifications section of this data sheet careful y. Only the automotive grade product shown is available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models. Rev. 0 | Page 6 of 8 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Absolute Maximum Ratings ESD Caution Pad Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide Automotive Products