Datasheet BLP05H9S500P (Ampleon) - 9

BLP05H9S500P Power LDMOS transistor
OMP-780-4F-1 Drawing Notes Items Description Dimensions are excluding mold protrusion. All areas located adjacent to the leads have a maximum mold protrusion of 0.25 (1) mm (per side) and max. 0.62 mm in length. At all other areas the mold protrusion is maximum 0.15 mm per side. See also detail B. (2) The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A). (3) The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location. (4) The lead coplanarity over all leads is 0.1 mm maximum. (5) Dimension is measured 0.5 mm from the edge of the top package body. (6) The hatched area indicates the exposed metal heatsink. (7) The leads and exposed heatsink are plated with matte Tin (Sn). location of metal protrusion (2) DETAIL A SCALE 25:1 B A lead dambar location 0.25 max. (1) 0.15 max. (1) 0.62 max. (1) DETAIL B SCALE 50:1 0 Package outline drawing: Tolerances unless otherwise stated: Revision: Dimension: B 0.05 Angle: B 1° Revision date: 3/1/2018 units in mm. OMP-780-4F-1 Third angle projection Sheet 2 of 2
Fig 14. Package outline OMP-780-4F-1 (sheet 2 of 2)
BLP05H9S500P All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2019. All rights reserved.
Product data sheet Rev. 1 — 10 September 2019 9 of 13
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Test information 7.1 Ruggedness in class-AB operation 7.2 Impedance information 7.3 Application circuit 7.4 Graphical data 8. Package outline 9. Handling information 10. Abbreviations 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents