LTM8078 ABSOLUTE MAXIMUM RATINGSPIN CONFIGURATION(Note 1) VINn, RUN, PGn ..42V GND RT FB2 FB1 BIAS V 7 OUTn, BIAS ...10V BANK 2 FBn, OM, OMC, TRSSn, RT ..4V TRSS2 TRSS1 OM OMC VOUT2 6 SYNC ..6V RUN Maximum Internal Temperature (Note 2) .. 125°C 5 Storage Temperature ... –55°C to 125°C VIN2 BANK 3 Peak Solder Reflow Package Body Temperature ..260°C 4 V GND IN1 3 PG2 2 BANK 1 PG1 SYNC CLKOUT VOUT1 1 A B C D E F G BGA PACKAGE 49-PIN (6.25mm × 6.25mm × 2.22mm) TJMAX = 125°C, θJA = 31.3°C/W, θJCtop = 30.5°C/W, θJCbot = 10.6°C/W, WEIGHT = 0.23g θ VALUES DETERMINED PER JESD 51-9, 51-12 ORDER INFORMATIONPART MARKINGPACKAGEMSLTEMPERATURE RANGEPART NUMBERPAD OR BALL FINISHDEVICEFINISH CODETYPERATING(SEE NOTE 2) LTM8078EY#PBF SAC305 (RoHS) 8078 1 BGA 3 –40°C to 125°C LTM8078IY#PBF • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Application Package Description Package Photograph Related Parts
