CMS11 iF – vF PF (AV) – IF (AV) 100 1.6 ) DC (A 1.4 ation α = 180° 1.2 t i F ssip 10 α = 120° di Tj = 150°C 1.0 (W) wer α = 60° 125°C ard curren po 0.8 w V) ard Rectangular 75°C w F (AP 0.6 waveform 1 for ous for ge 0.4 ane 25°C ant vera 0° α 360° A 0.2 Inst Conduction angle: α 0.1 0.0 0 0.2 0.8 0.4 0.6 1.0 1.2 1.4 1.6 0.4 0.0 0.8 1.2 2.0 2.4 1.6 2.8 3.2 Instantaneous forward voltage vF (V) Average forward current IF (AV) (A) Ta max – IF (AV) Device mounted on a ceramic board (board size: 50 mm × 50 mm) Tℓ max – IF (AV) 160 160 Rectangular waveform ture 140 DC 140 DC IF(AV) 120 0° α 360° 120 t tempera Conduction angle: α α = 120° ) temperature ) 100 VR = 20 V 100 α = 180° α = 180° (°C (°C α = 60° α = 120° 80 e lead 80 e ambien bl Rectangular bl waveform ℓ max 60 owa ℓ max T T 60 owa 40 α = 60° 40 0° α 360° I F(AV) 20 Maximum all 20 Conduction angle: α Maximum all VR = 20 V 0 0 0.4 0 0.8 1.2 2.0 2.4 1.6 2.8 3.2 0.4 0 0.8 1.2 2.0 2.4 1.6 2.8 3.2 Average forward current IF (AV) (A) Average forward current IF (AV) (A) rth (j-a) – t 1000 C/W) (° Device mounted on a glass-epoxy board ) Soldering land: 2.1 mm × 1.4 mm -a 100 r th (j pedance Device mounted on a glass-epoxy board m Soldering land: 6.0 mm × 6.0 mm 10 ermal i Device mounted on a ceramic board nt th Soldering land: 2.0 mm × 2.0 mm ransie T 1 0.001 0.01 0.1 1 10 100 1000 Time t (s) 3 2013-11-01 Document Outline TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type Absolute Maximum Ratings (Ta 25°C) Electrical Characteristics (Ta 25°C) Marking Standard Soldering Pad RESTRICTIONS ON PRODUCT USE
