Datasheet ISM330DHCX (STMicroelectronics)

ISM330DHCX
Datasheet iNEMO inertial module with embedded Machine Learning Core: always-on 3D accelerometer and 3D gyroscope with digital output for industrial applications
Features
• 3D accelerometer with selectable full scale: ±2/±4/±8/±16 g • 3D gyroscope with extended selectable full scale:
LGA-14L
±125/±250/±500/±1000/±2000/±4000 dps
(2.5 x 3.0 x 0.83 mm) typ.
• Extended temperature range from -40 to +105 °C • Embedded compensation for high stability over temperature • SPI/I²C serial interface • Auxiliary SPI serial interface for data output of gyroscope and accelerometer (OIS and other stabilization applications) • Six-channel synchronized output • Sensor hub feature to efficiently collect data from additional external sensors • Embedded smart FIFO up to 9 kbytes • Programmable Finite State Machine to process data from accelerometer, gyroscope, and external sensors • Machine Learning Core • Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click • Embedded pedometer, step detector and counter for healthcare applications • Analog supply voltage: 1.71 V to 3.6 V • Embedded temperature sensor • Embedded self-test both for gyroscope and accelerometer • High shock survivability
Product status link
• ECOPACK, RoHS and “Green” compliant ISM330DHCX
Product summary Applications Order code
ISM330DHCX ISM330DHCXTR • Industrial IoT and connected devices
Temp. range
• Antennas, platforms, and optical image and lens stabilization -40 to +85
[°C]
• Robotics, Drones and industrial automation LGA-14L
Package
(2.5 x 3.0 x 0.83 mm) • Navigation systems and telematics
Packing
Tray Tape & Reel • Vibration monitoring and compensation
Product labels Description
The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
Product resources
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows AN5398 (ISM330DHCX) the design of a dedicated circuit which is trimmed to better match the characteristics AN5392 (Machine Learning Core) of the sensing element. AN5388 (Finite State Machine) TN0018 (Design and soldering)
DS13012
-
Rev 5
-
March 2020
www.st.com For further information contact your local STMicroelectronics sales office. Document Outline Features Applications Description 1 Overview 2 Embedded low-power features 2.1 Finite State Machine 2.2 Machine Learning Core 3 Pin description 3.1 Pin connections 4 Module specifications 4.1 Mechanical characteristics 4.2 Electrical characteristics 4.3 Temperature sensor characteristics 4.4 Communication interface characteristics 4.4.1 SPI - serial peripheral interface 4.4.2 I²C - inter-IC control interface 4.5 Absolute maximum ratings 4.6 Terminology 4.6.1 Sensitivity 4.6.2 Zero-g and zero-rate level 5 Digital interfaces 5.1 I²C/SPI interface 5.1.1 I²C serial interface 5.1.1.1 I²C operation 5.1.2 SPI bus interface 5.1.2.1 SPI read 5.1.2.2 SPI write 5.1.2.3 SPI read in 3-wire mode 5.2 Master I²C interface 5.3 Auxiliary SPI interface 6 Functionality 6.1 Operating modes 6.2 Gyroscope power modes 6.3 Accelerometer power modes 6.4 Block diagram of filters 6.4.1 Block diagrams of the accelerometer filters 6.4.2 Block diagrams of the gyroscope filters 6.5 FIFO 6.5.1 Bypass mode 6.5.2 FIFO mode 6.5.3 Continuous mode 6.5.4 Continuous-to-FIFO mode 6.5.5 Bypass-to-Continuous mode 6.5.6 Bypass-to-FIFO mode 6.5.7 FIFO reading procedure 7 Application hints 7.1 ISM330DHCX electrical connections in Mode 1 7.2 ISM330DHCX electrical connections in Mode 2 7.3 ISM330DHCX electrical connections in Mode 3 and Mode 4 8 Register mapping 9 Register description 9.1 FUNC_CFG_ACCESS (01h) 9.2 PIN_CTRL (02h) 9.3 FIFO_CTRL1 (07h) 9.4 FIFO_CTRL2 (08h) 9.5 FIFO_CTRL3 (09h) 9.6 FIFO_CTRL4 (0Ah) 9.7 COUNTER_BDR_REG1 (0Bh) 9.8 COUNTER_BDR_REG2 (0Ch) 9.9 INT1_CTRL (0Dh) 9.10 INT2_CTRL (0Eh) 9.11 WHO_AM_I (0Fh) 9.12 CTRL1_XL (10h) 9.13 CTRL2_G (11h) 9.14 CTRL3_C (12h) 9.15 CTRL4_C (13h) 9.16 CTRL5_C (14h) 9.17 CTRL6_C (15h) 9.18 CTRL7_G (16h) 9.19 CTRL8_XL (17h) 9.20 CTRL9_XL (18h) 9.21 CTRL10_C (19h) 9.22 ALL_INT_SRC (1A) 9.23 WAKE_UP_SRC (1Bh) 9.24 TAP_SRC (1Ch) 9.25 DRD_SRC (1Dh) 9.26 STATUS_REG (1Eh) / STATUS_SPIAux (1Eh) 9.27 OUT_TEMP_L (20h), OUT_TEMP_H (21h) 9.28 OUTX_L_G (22h) and OUTX_H_G (23h) 9.29 OUTY_L_G (24h) and OUTY_H_G (25h) 9.30 OUTZ_L_G (26h) and OUTZ_H_G (27h) 9.31 OUTX_L_A (28h) and OUTX_H_A (29h) 9.32 OUTY_L_A (2Ah) and OUTY_H_A (2Bh) 9.33 OUTZ_L_A (2Ch) and OUTZ_H_A (2Dh) 9.34 EMB_FUNC_STATUS_MAINPAGE (35h) 9.35 FSM_STATUS_A_MAINPAGE (36h) 9.36 FSM_STATUS_B_MAINPAGE (37h) 9.37 MLC_STATUS_MAINPAGE (38h) 9.38 STATUS_MASTER_MAINPAGE (39h) 9.39 FIFO_STATUS1 (3Ah) 9.40 FIFO_STATUS2 (3Bh) 9.41 TIMESTAMP0 (40h), TIMESTAMP1 (41h), TIMESTAMP2 (42h), and TIMESTAMP3 (43h) 9.42 TAP_CFG0 (56h) 9.43 TAP_CFG1 (57h) 9.44 TAP_CFG2 (58h) 9.45 TAP_THS_6D (59h) 9.46 INT_DUR2 (5Ah) 9.47 WAKE_UP_THS (5Bh) 9.48 WAKE_UP_DUR (5Ch) 9.49 FREE_FALL (5Dh) 9.50 MD1_CFG (5Eh) 9.51 MD2_CFG (5Fh) 9.52 INTERNAL_FREQ_FINE (63h) 9.53 INT_OIS (6Fh) 9.54 CTRL1_OIS (70h) 9.55 CTRL2_OIS (71h) 9.56 CTRL3_OIS (72h) 9.57 X_OFS_USR (73h) 9.58 Y_OFS_USR (74h) 9.59 Z_OFS_USR (75h) 9.60 FIFO_DATA_OUT_TAG (78h) 9.61 FIFO_DATA_OUT_X_L (79h) and FIFO_DATA_OUT_X_H (7Ah) 9.62 FIFO_DATA_OUT_Y_L (7Bh) and FIFO_DATA_OUT_Y_H (7Ch) 9.63 FIFO_DATA_OUT_Z_L (7Dh) and FIFO_DATA_OUT_Z_H (7Eh) 10 Embedded functions register mapping 11 Embedded functions register description 11.1 PAGE_SEL (02h) 11.2 EMB_FUNC_EN_A (04h) 11.3 EMB_FUNC_EN_B (05h) 11.4 PAGE_ADDRESS (08h) 11.5 PAGE_VALUE (09h) 11.6 EMB_FUNC_INT1 (0Ah) 11.7 FSM_INT1_A (0Bh) 11.8 FSM_INT1_B (0Ch) 11.9 MLC_INT1 (0Dh) 11.10 EMB_FUNC_INT2 (0Eh) 11.11 FSM_INT2_A (0Fh) 11.12 FSM_INT2_B (10h) 11.13 MLC_INT2 (11h) 11.14 EMB_FUNC_STATUS (12h) 11.15 FSM_STATUS_A (13h) 11.16 FSM_STATUS_B (14h) 11.17 MLC_STATUS (15h) 11.18 PAGE_RW (17h) 11.19 EMB_FUNC_FIFO_CFG (44h) 11.20 FSM_ENABLE_A (46h) 11.21 FSM_ENABLE_B (47h) 11.22 FSM_LONG_COUNTER_L (48h) and FSM_LONG_COUNTER_H (49h) 11.23 FSM_LONG_COUNTER_CLEAR (4Ah) 11.24 FSM_OUTS1 (4Ch) 11.25 FSM_OUTS2 (4Dh) 11.26 FSM_OUTS3 (4Eh) 11.27 FSM_OUTS4 (4Fh) 11.28 FSM_OUTS5 (50h) 11.29 FSM_OUTS6 (51h) 11.30 FSM_OUTS7 (52h) 11.31 FSM_OUTS8 (53h) 11.32 FSM_OUTS9 (54h) 11.33 FSM_OUTS10 (55h) 11.34 FSM_OUTS11 (56h) 11.35 FSM_OUTS12 (57h) 11.36 FSM_OUTS13 (58h) 11.37 FSM_OUTS14 (59h) 11.38 FSM_OUTS15 (5Ah) 11.39 FSM_OUTS16 (5Bh) 11.40 EMB_FUNC_ODR_CFG_B (5Fh) 11.41 EMB_FUNC_ODR_CFG_C (60h) 11.42 STEP_COUNTER_L (62h) and STEP_COUNTER_H (63h) 11.43 EMB_FUNC_SRC (64h) 11.44 EMB_FUNC_INIT_A (66h) 11.45 EMB_FUNC_INIT_B (67h) 11.46 MLC0_SRC (70h) 11.47 MLC1_SRC (71h) 11.48 MLC2_SRC (72h) 11.49 MLC3_SRC (73h) 11.50 MLC4_SRC (74h) 11.51 MLC5_SRC (75h) 11.52 MLC6_SRC (76h) 11.53 MLC7_SRC (77h) 12 Embedded advanced features pages 13 Embedded advanced features register description 13.1 Page 0 - Embedded advanced features registers 13.1.1 MAG_SENSITIVITY_L (BAh) and MAG_SENSITIVITY_H (BBh) 13.1.2 MAG_OFFX_L (C0h) and MAG_OFFX_H (C1h) 13.1.3 MAG_OFFY_L (C2h) and MAG_OFFY_H (C3h) 13.1.4 MAG_OFFZ_L (C4h) and MAG_OFFZ_H (C5h) 13.1.5 MAG_SI_XX_L (C6h) and MAG_SI_XX_H (C7h) 13.1.6 MAG_SI_XY_L (C8h) and MAG_SI_XY_H (C9h) 13.1.7 MAG_SI_XZ_L (CAh) and MAG_SI_XZ_H (CBh) 13.1.8 MAG_SI_YY_L (CCh) and MAG_SI_YY_H (CDh) 13.1.9 MAG_SI_YZ_L (CEh) and MAG_SI_YZ_H (CFh) 13.1.10 MAG_SI_ZZ_L (D0h) and MAG_SI_ZZ_H (D1h) 13.1.11 MAG_CFG_A (D4h) 13.1.12 MAG_CFG_B (D5h) 13.2 Page 1 - Embedded advanced features registers 13.2.1 FSM_LC_TIMEOUT_L (7Ah) and FSM_LC_TIMEOUT_H (7Bh) 13.2.2 FSM_PROGRAMS (7Ch) 13.2.3 FSM_START_ADD_L (7Eh) and FSM_START_ADD_H (7Fh) 13.2.4 PEDO_CMD_REG (83h) 13.2.5 PEDO_DEB_CONF (84h) 13.2.6 PEDO_SC_DELTAT_L (D0h) and PEDO_SC_DELTAT_H (D1h) 13.2.7 MLC_MAG_SENSITIVITY_L (E8h) and MLC_MAG_SENSITIVITY_H (E9h) 14 Sensor hub register mapping 15 Sensor hub register description 15.1 SENSOR_HUB_1 (02h) 15.2 SENSOR_HUB_2 (03h) 15.3 SENSOR_HUB_3 (04h) 15.4 SENSOR_HUB_4 (05h) 15.5 SENSOR_HUB_5 (06h) 15.6 SENSOR_HUB_6 (07h) 15.7 SENSOR_HUB_7 (08h) 15.8 SENSOR_HUB_8 (09h) 15.9 SENSOR_HUB_9 (0Ah) 15.10 SENSOR_HUB_10 (0Bh) 15.11 SENSOR_HUB_11 (0Ch) 15.12 SENSOR_HUB_12 (0Dh) 15.13 SENSOR_HUB_13 (0Eh) 15.14 SENSOR_HUB_14 (0Fh) 15.15 SENSOR_HUB_15 (10h) 15.16 SENSOR_HUB_16 (11h) 15.17 SENSOR_HUB_17 (12h) 15.18 SENSOR_HUB_18 (13h) 15.19 MASTER_CONFIG (14h) 15.20 SLV0_ADD (15h) 15.21 SLV0_SUBADD (16h) 15.22 SLAVE0_CONFIG (17h) 15.23 SLV1_ADD (18h) 15.24 SLV1_SUBADD (19h) 15.25 SLAVE1_CONFIG (1Ah) 15.26 SLV2_ADD (1Bh) 15.27 SLV2_SUBADD (1Ch) 15.28 SLAVE2_CONFIG (1Dh) 15.29 SLV3_ADD (1Eh) 15.30 SLV3_SUBADD (1Fh) 15.31 SLAVE3_CONFIG (20h) 15.32 DATAWRITE_SLV0 (21h) 15.33 STATUS_MASTER (22h) 16 Soldering information 17 Package information 17.1 LGA-14L package information 17.2 LGA-14 packing information Revision history Contents List of tables List of figures