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Datasheet DN3545 (Microchip) - 6

ПроизводительMicrochip
ОписаниеN-Channel Depletion-Mode Vertical DMOS FET
Страниц / Страница14 / 6 — DN3545. 3.0. PIN DESCRIPTION. Package Types. TABLE 3-1:. 3-LEAD TO-92 PIN …
Формат / Размер файлаPDF / 1.8 Мб
Язык документаанглийский

DN3545. 3.0. PIN DESCRIPTION. Package Types. TABLE 3-1:. 3-LEAD TO-92 PIN FUNCTION TABLE. Pin Number. Pin Name. Description. TABLE 3-2:

DN3545 3.0 PIN DESCRIPTION Package Types TABLE 3-1: 3-LEAD TO-92 PIN FUNCTION TABLE Pin Number Pin Name Description TABLE 3-2:

28 предложений от 16 поставщиков
Транзистор: N-MOSFET; полевой; 450В; 0,2А; 1,6Вт; SOT89-3
Maybo
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DN3545N8-G
Microchip
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DN3545N8-G
Microchip
143 ₽
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DN3545N8-G
Microchip
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DN3545N8-G
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DN3545 3.0 PIN DESCRIPTION
The details on the pins of 3-lead TO-92 and 3-lead SOT-89 packages are listed on Table 3-1 and Table 3-2, respectively. The locations of pins are indicated in
Package Types
.
TABLE 3-1: 3-LEAD TO-92 PIN FUNCTION TABLE Pin Number Pin Name Description
1 Source Source 2 Gate Gate 3 Drain Drain
TABLE 3-2: 3-LEAD SOT-89 PIN FUNCTION TABLE Pin Number Pin Name Description
1 Gate Gate 2, 4 Drain Drain 3 Source Source DS20005438A-page 6  2018 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Output Characteristics. FIGURE 2-2: Transconductance vs. Drain Current. FIGURE 2-3: Maximum Rated Safe Operating Area. FIGURE 2-4: Saturation Characteristics. FIGURE 2-5: Power Dissipation vs. Ambient Temperature. FIGURE 2-6: Thermal Response Characteristics. FIGURE 2-7: BVDSS Variation with Temperature. FIGURE 2-8: Transfer Characteristics. FIGURE 2-9: Capacitance vs. Drain-to- Source Voltage. FIGURE 2-10: On-Resistance vs. Drain Current. FIGURE 2-11: VGS(th) and RDS(ON) Variation with Temperature. FIGURE 2-12: Gate Drive Dynamic Characteristics. 3.0 Pin Description TABLE 3-1: 3-lead TO-92 Pin Function Table TABLE 3-2: 3-lead SOT-89 Pin Function Table 4.0 Functional Description FIGURE 4-1: Switching Waveforms and Test Circuit. TABLE 4-1: Product Summary 5.0 Packaging Information 5.1 Package Marking Information AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Dallas Detroit Houston, TX Indianapolis Los Angeles Raleigh, NC New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Guangzhou China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Suzhou China - Wuhan China - Xian China - Xiamen China - Zhuhai ASIA/PACIFIC India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok Vietnam - Ho Chi Minh EUROPE Austria - Wels Denmark - Copenhagen Finland - Espoo France - Paris Germany - Garching Germany - Haan Germany - Heilbronn Germany - Karlsruhe Germany - Munich Germany - Rosenheim Israel - Ra’anana Italy - Milan Italy - Padova Netherlands - Drunen Norway - Trondheim Poland - Warsaw Romania - Bucharest Spain - Madrid Sweden - Gothenberg Sweden - Stockholm UK - Wokingham
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