Datasheet TPD7107F (Toshiba) - 6

TPD7107F 7.3.2. Protection for disconnection of GND terminal
GND disconnection protection is a function that keeps an OFF state in order to prevent a malfunction of the external FET, when GND terminal wiring of a unit is disconnected. In OPEN state as shown in Figure7.5, the off driver of GND disconnection operates, and turn off the external FET regardless of the condition of an input signal.
Figure 7.5 Protection circuit for disconnection of GND terminal.
GND open. VIN VDD VGND < VUV3 VGATE OFF drive for GND open. Decreas e of VGATE ● VIN: IN pin input voltage ● VGND: GND pin voltage ● VGATE: GATE pin output voltage ● VUV3: Low voltage latch threshold
Figure 7.6 Protect operation of disconnection of GND terminal.
© 2 020 6 2020-04-09 Toshiba Electronic Devices & Storage Corporation Document Outline 1. Description 2. Uses 3. Features 4. Block Diagram 5. Pin Assignments 6. Pin Description 7. Operational Description 7.1. Protection for reverse connection of power supply 7.2. Active clamp 7.3. Gate drive of Power MOSFET (Off driver) 7.3.1. Normal off, rapid off 7.3.2. Protection for disconnection of GND terminal 7.4. Load current sense at time of Power MOSFET drive 7.5. The abnormalities in power supply voltage (VDD over voltage, VDD under voltage) 7.6. Over current protection 7.7. Over temperature protection. 7.8. Abnormalities in voltage between Drain and source of the external FET (VDS error) 7.9. Load open / VDD short of load line and diagnosis output 7.10. Truth Table 7.11. State Transition Diagram 8. Absolute Maximum Ratings 8.1. Thermal Resistance 9. Operating Ranges 10. Electrical Characteristics 10.1. Electrical characteristics 1 10.2. Electrical characteristics 2 10.3. Current sense amp Electrical Characteristics 11. Test Circuit 11.1. Test circuit 1 High level output voltage (3) 11.2. Test circuit 2 Switching time (Td-ON, Td-OFF, Tr, Tf) 11.3. Test circuit 3 Off impedance at GND open 11.4. Test circuit 4 Input offset voltage 12. Characteristic curves 13. Package Information 13.1. Package Dimensions 13.2. Marking 13.3. Land Pattern Dimensions for Reference only 14. IC Usage Notes 14.1. Notes on Handling of ICs 14.2. Notes on mounting. RESTRICTIONS ON PRODUCT USE