Datasheet ADA4638-1 (Analog Devices) - 6

ADA4638-1 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 5.
θ
Parameter Rating
JA is specified for a device soldered on a 4-layer JEDEC standard board with zero airflow. For LFCSP packages, the Supply Voltage 33 V exposed pad is soldered to the board. Input Voltage1 ±VSY Input Current ±10 mA
Table 6. Thermal Resistance
Differential Input Voltage ±VSY
Package Type θJA θJC Unit
Output Short-Circuit Duration to GND Indefinite 8-Lead SOIC 120 45 °C/W Storage Temperature Range −65°C to +150°C 8-Lead LFCSP 75 12 °C/W Operating Temperature Range −40°C to +125°C Junction Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 300°C
ESD CAUTION
1 Input voltage should always be limited to less than 30 V. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 6 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS—30 V OPERATION ELECTRICAL CHARACTERISTICS—10 V OPERATION ELECTRICAL CHARACTERISTICS—5 V OPERATION ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION DIFFERENTIATION THEORY OF OPERATION INPUT PROTECTION NO OUTPUT PHASE REVERSAL NOISE CONSIDERATIONS 1/f Noise COMPARATOR OPERATION PRECISION LOW-SIDE CURRENT SHUNT SENSOR PRINTED CIRCUIT BOARD LAYOUT OUTLINE DIMENSIONS ORDERING GUIDE