AD8565/AD8566/AD8567Data SheetABSOLUTE MAXIMUM RATINGS Table 2.THERMAL RESISTANCEParameterRating θJA is specified for worst-case conditions, that is, for a device Supply Voltage (V soldered onto a circuit board for surface-mount packages. S) 18 V Input Voltage −0.5 V to VS + 0.5 V Table 3. Thermal Resistance Differential Input Voltage VS Package TypeθJAθJCUnit Storage Temperature Range −65°C to +150°C 5-Lead SC70 (KS-5) 376 126 °C/W Operating Temperature Range −40°C to +85°C 8-Lead MSOP (RM-8) 210 45 °C/W Junction Temperature Range −65°C to +150°C 14-Lead TSSOP (RU-14) 180 35 °C/W Lead Temperature (Soldering, 60 sec) 300°C 16-Lead LFCSP (CP-16-23) 381 301 °C/W Stresses at or above those listed under Absolute Maximum 1 DAP is soldered down to the printed circuit board (PCB). Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these ESD CAUTION or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. H | Page 4 of 13 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INPUT OVERVOLTAGE PROTECTION OUTPUT PHASE REVERSAL POWER DISSIPATION THERMAL PAD—AD8567 TOTAL HARMONIC DISTORTION + NOISE (THD + N) SHORT-CIRCUIT OUTPUT CONDITIONS LCD PANEL APPLICATIONS OUTLINE DIMENSIONS ORDERING GUIDE
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