Datasheet LT3001 (Analog Devices) - 10

LT3001
PACKAGE DESCRIPTION S5 Package 5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635 Rev B) 0.62 0.95 2.90 BSC MAX REF (NOTE 4) 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE RECOMMENDED SOLDER PAD LAYOUT 0.30 – 0.45 TYP 0.95 BSC PER IPC CALCULATOR 5 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.90 BSC NOTE: (NOTE 3) S5 TSOT-23 0302 REV B 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 Rev. 0 10 08/19 www.analog.com For more information www.analog.com ANALOG DEVICES, INC. 2019 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Operation Applications Information Package Description