Datasheet VL53L3CX (STMicroelectronics) - 9

VL53L3CX Power sequence 2.8 Power sequence 2.8.1 Power up and boot sequence
There are two options available for device power up/boot.
Option 1
: The XSHUT pin is connected and controlled from the host. This option optimizes power consumption as the device can be completely powered off when not used, and then woken up through the host GPIO (using the XSHUT pin). HW Standby mode is defined as the period when AVDD is present and XSHUT is low
Figure 6. Power up and boot sequence Option 2
: The XSHUT pin is not controlled by the host, it is tied to AVDD through the pull-up resistor. When the XSHUT pin is not controlled, the power-up sequence is presented in the figure below. In this case, the device goes automatically to SW STANDBY after FW BOOT, without entering HW STANDBY.
Figure 7. Power up and boot sequence with XSHUT not controlled
Note: In both cases, tBOOT is 1.2 ms max. Note: In both cases, XSHUT has to be raised only when AVDD is tied on. Note: The VL53L3CX must only exit reset when there is no existing I2C transaction taking place on the bus i.e. do not raise the XSHUT when there is an existing I2C command in progress, wait until the current I2C command has completed.
DS13204
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Rev 2 page 9/35
Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents