Datasheet AD5592R-1-KGD (Analog Devices) - 10

AD5592R-1-KGD Known Good Die OUTLINE DIMENSIONS 0.25 2.00 3 2 1 27 26 25 24 4 23 5 22 6 7 21 2.00 8 20 9 19 10 18 11 17 12 13 14 15 16 A TOP VIEW SIDE VIEW 2017- 0.070 × 0.070 (CIRCUIT SIDE) 06- 03-
Figure 5. 27-Pad Bare Die [CHIP] (C-27-1) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Die Size (Maximum) 2000 × 2000 µm Bond Pad (Minimum) 70 × 70 µm Thickness 250 µm Scribe Line Width 80 µm Bond Pad Composition AlCu (0.5%) % Passivation Type Polyimide Not applicable Backside Bias GND Not applicable
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy Adhesive Bonding Method 1.0 mil, 2N gold wire1 1 Evaluate gold wire for suitability before use at elevated temperatures for extended durations.
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD5592R-1-KGD-PT −40°C to +105°C 27-Pad Bare Die [CHIP] C-27-1
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Rev. 0 | Page 10 of 10 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Timing Characteristics Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide