Datasheet ADuM5401, ADuM5402, ADuM5403, ADuM5404 (Analog Devices) - 9

Data Sheet ADuM5401/ADuM5402/ADuM5403/ADuM5404 Table 13. Input and Output Characteristics Test Parameter Symbol Min Typ Max Unit Conditions/Comments
DC SPECIFICATIONS Logic High Input Threshold VIH 0.7 × VISO or 0.7 × V VDD1 Logic Low Input Threshold VIL 0.3 × VISO or 0.3 × V VDD1 Logic High Output Voltages VOH VDD1 − 0.2, VISO − 0.2 VDD1 or VISO V IOx = −20 μA, VIx = VIxH VDD1 − 0.5 or VDD1 − 0.2 or V IOx = −4 mA, VIx = VIxH VISO − 0.5 VISO − 0.2 Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = VIxL 0.0 0.4 V IOx = 4 mA, VIx = VIxL Undervoltage Lockout UVLO VDD1, VDDL, VISO supplies Positive Going Threshold VUV+ 2.7 V Negative Going VUV− 2.4 V Threshold Hysteresis VUVH 0.3 V Input Currents per Channel II −10 +0.01 +10 μA 0 V ≤ VIx ≤ VDDx AC SPECIFICATIONS Output Rise/Fall Time tR/tF 2.5 ns 10% to 90% Common-Mode Transient |CM| 25 35 kV/μs VIx = VDD1 or VISO, VCM = 1000 V, Immunity1 transient magnitude = 800 V Refresh Rate fr 1.0 Mbps 1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.7 × VDD1 or 0.7 × VISO for a high output or VO < 0.3 × VDD1 or 0.3 × VISO for a low output. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. Rev. E | Page 9 of 29 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS—5 V PRIMARY INPUT SUPPLY/5 V SECONDARY ISOLATED SUPPLY ELECTRICAL CHARACTERISTICS—3.3 V PRIMARY INPUT SUPPLY/3.3 V SECONDARY ISOLATED SUPPLY ELECTRICAL CHARACTERISTICS—5 V PRIMARY INPUT SUPPLY/3.3 V SECONDARY ISOLATED SUPPLY PACKAGE CHARACTERISTICS REGULATORY INFORMATION INSULATION AND SAFETY-RELATED SPECIFICATIONS IEC 60747-5-2 (VDE 0884, PART 2):2003-01 INSULATION CHARACTERISTICS RECOMMENDED OPERATING CONDITIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TRUTH TABLE TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY APPLICATIONS INFORMATION PCB LAYOUT THERMAL ANALYSIS PROPAGATION DELAY-RELATED PARAMETERS START-UP BEHAVIOR EMI CONSIDERATIONS DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY POWER CONSUMPTION POWER CONSIDERATIONS INCREASING AVAILABLE POWER INSULATION LIFETIME OUTLINE DIMENSIONS ORDERING GUIDE NOTES NOTES