Datasheet HIP2210, HIP2211 (Renesas) - 2

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Contents 1. Overview . 3
1.1 Block Diagrams . 3 1.2 Ordering Information . 4 1.3 Pin Configurations . 4 1.4 Pin Descriptions . 5
2. Specifications . 6
2.1 Absolute Maximum Ratings . 6 2.2 Thermal Information . 6 2.3 Recommended Operating Conditions . 7 2.4 Electrical Specifications . 7 2.5 Switching Specifications . 9 2.6 Timing Diagrams . 12
3. Typical Performance Curves . 13 4. Functional Description . 17
4.1 Gate Drive for NMOS Half-Bridge . 17 4.2 Functional Overview . 17
5. Applications Information . 18
5.1 HI/LI Input Control (HIP2211 Only) . 18 5.2 PWM Input Control (HIP2210 Only) . 18 5.3 VREF Input (HIP2210 Only) . 18 5.4 EN Pin (HIP2210 Only) . 18 5.5 Power Sequencing HIP2210 . 18 5.6 Selecting the Boot Capacitor Value . 19 5.7 VDD Decoupling Capacitor . 20 5.8 RDT and Dead Time Delay (HIP2210 Only) . 20 5.9 HO and LO Outputs . 20 5.10 Power Dissipation . 20
6. PCB Layout Guidelines . 22
6.1 PCB Layout and EPAD Recommendation . 23
7. Revision History . 24 8. Package Outline Drawings . 25
FN9347 Rev.1.01 Page 2 of 27 Jun.23.20 Document Outline Related Literature Features Applications Contents 1. Overview 1.1 Block Diagrams 1.2 Ordering Information 1.3 Pin Configurations 1.4 Pin Descriptions 2. Specifications 2.1 Absolute Maximum Ratings 2.2 Thermal Information 2.3 Recommended Operating Conditions 2.4 Electrical Specifications 2.5 Switching Specifications 2.6 Timing Diagrams 3. Typical Performance Curves 4. Functional Description 4.1 Gate Drive for NMOS Half-Bridge 4.2 Functional Overview 5. Applications Information 5.1 HI/LI Input Control (HIP2211 Only) 5.2 PWM Input Control (HIP2210 Only) 5.3 VREF Input (HIP2210 Only) 5.4 EN Pin (HIP2210 Only) 5.5 Power Sequencing HIP2210 5.6 Selecting the Boot Capacitor Value 5.7 VDD Decoupling Capacitor 5.8 RDT and Dead Time Delay (HIP2210 Only) 5.9 HO and LO Outputs 5.10 Power Dissipation 5.10.1 Gate Power (for the HO and LO Outputs) 5.10.2 Boot Diode Dissipation 5.10.3 Dynamic Operating Current 5.10.4 Total Power Dissipation 5.10.5 Junction Operating Temperature 6. PCB Layout Guidelines 6.1 PCB Layout and EPAD Recommendation 7. Revision History 8. Package Outline Drawings