Data SheetADL5902ABSOLUTE MAXIMUM RATINGSTable 2. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a Parameter Rating stress rating only; functional operation of the product at these Supply Voltage, VPOS 5.5 V or any other conditions above those indicated in the operational Input Average RF Power1 21 dBm section of this specification is not implied. Operation beyond Equivalent Voltage, Sine Wave Input 2.51 V p-p the maximum operating conditions for extended periods may Internal Power Dissipation 550 mW affect product reliability. θ 2 JC 10.6°C/W θ 2 JB 35.3°C/W ESD CAUTION θ 2 JA 57.2°C/W Ψ 2 JT 1.0°C/W Ψ 2 JB 34°C/W Maximum Junction Temperature 150°C Operating Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 300°C 1 This is for long durations. Excursions above this level, with durations much less than 1 second, are possible without damage. 2 No airflow with the exposed pad soldered to a 4-layer JEDEC board. Rev. B | Page 7 of 28 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SQUARE LAW DETECTOR AND AMPLITUDE TARGET RF INPUT INTERFACE SMALL SIGNAL LOOP RESPONSE TEMPERATURE SENSOR INTERFACE VREF INTERFACE TEMPERATURE COMPENSATION INTERFACE POWER-DOWN INTERFACE VSET INTERFACE OUTPUT INTERFACE VTGT INTERFACE BASIS FOR ERROR CALCULATIONS MEASUREMENT MODE BASIC CONNECTIONS SETTING VTADJ SETTING VTGT CHOOSING A VALUE FOR CLPF OUTPUT VOLTAGE SCALING SYSTEM CALIBRATION AND ERROR CALCULATION HIGH FREQUENCY PERFORMANCE LOW FREQUENCY PERFORMANCE DESCRIPTION OF CHARACTERIZATION EVALUATION BOARD SCHEMATICS AND ARTWORK ASSEMBLY DRAWINGS OUTLINE DIMENSIONS ORDERING GUIDE
