HMC8100LP6JEData SheetABSOLUTE MAXIMUM RATINGS Stresses at or above those listed under Absolute Maximum Table 4. Ratings may cause permanent damage to the product. This is a ParameterRating stress rating only; functional operation of the product at these RF Input 10 dBm or any other conditions above those indicated in the operational LO Input 10 dBm section of this specification is not implied. Operation beyond VCCX −0.5 V to +5.5 V the maximum operating conditions for extended periods may −0.3 V to +3.6 V affect product reliability. Maximum Junction Temperature to 150°C Maintain 1 Million Hour MTTF ESD CAUTION Thermal Resistance (RTH), Junction to 10.5°C/W Ground Paddle Temperature Operating −40°C to +85°C Storage −65°C to +150°C Maximum Peak Reflow Temperature 260°C (MSL3) ESD Sensitivity (Human Body Model) 2000 V (Class 2) Rev. B | Page 6 of 27 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS: 800 MHz TO 1800 MHz RF FREQUENCY RANGE ELECTRICAL CHARACTERISTICS: 1800 MHz TO 2800 MHz RF FREQUENCY RANGE ELECTRICAL CHARACTERISTICS: 2800 MHz TO 4000 MHz RF FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS EXTERNAL AGC CONFIGURATION INTERNAL AGC CONFIGURATION THEORY OF OPERATION REGISTER ARRAY ASSIGNMENTS AND SERIAL INTERFACE Read Example REGISTER DESCRIPTIONS REGISTER ARRAY ASSIGNMENTS Enable Bits Image Reject and Band-Pass Filter Bits Band-Pass Filter Bits: OTP and SPI AGC AGC: IF Gain Limit Bits Band-Pass Filter Bits: Calibration and 8-Bit Word Frequency AGC: Blocker Power Detector Bits Phase I Bits Phase Q Bits APPLICATIONS INFORMATION SCHEMATIC/TYPICAL APPLICATION CIRCUIT EVALUATION PRINTED CIRCUIT BOARD (PCB) OUTLINE DIMENSIONS ORDERING GUIDE
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