Datasheet ATBTLC1000-MR (Microchip) - 8

ATBTLC1000-MR110CA Pinout Information 4. Pinout Information
The following figure illustrates the top view and pin numbering of the module.
Figure 4-1. ATBTLC1000 Pin Description 3 2 1 0 1 1 1 1 2 1 _ _ _ _ S S M M IO IO IO IO _ _ P nd P P P nd G G G G IO IO _ _ _ _ P P rou rou G G LP G LP LP LP G 6 5 4 3 2 1 0 9 1 1 1 1 1 1 1 Chip_EN 17 8 LP_GPIO_9 RTC_CLKP 18 7 LP_GPIO_8 Paddle Pad - 25 RTC_CLKN 19 6 VBAT AO_GPIO_0 20 5 LP_GPIO_3 LP_GPIO_16 21 4 LP_GPIO_2 VDDIO 22 3 LP_GPIO_1 LP_GPIO_18 23 2 LP_GPIO_0 Ground 24 1 Ground BTLC1000-MR110CA MODULE BTLC1000_MR110CA_REV __ 4.1 Pin Description
The following table lists the pin assignments for the ATBTLC1000-MR110CA module.
Table 4-1. ATBTLC1000-MR110CA Pin Description ATBTLC1000- Pin Name Pin Type Description/Default Function MR110CA Pin No.
1 Ground Power Ground Pin. Connect to PCB ground 2 LP_GPIO_0 Digital I/O SWD clock © 2019 Microchip Technology Inc.
Datasheet
DS70005393A-page 8 Document Outline Introduction Features Table of Contents 1. Ordering Information 2. Package Information 3. Block Diagram 4. Pinout Information 4.1. Pin Description 5. Device States 5.1. Description of Device States 5.2. Controlling the Device States 6. Host Microcontroller Interface 7. Clocking 7.1. 26 MHz Crystal Oscillator (XO) 7.2. 32.768 kHz RTC Crystal Oscillator (RTC XO) 7.2.1. General Information 7.2.2. RTC XO Design and Interface Specification 7.2.3. RTC Characterization with Gm Code Variation 7.2.4. RTC Characterization with Supply Variation and Temperature 7.3. 2 MHz and 26 MHz Integrated RC Oscillators 8. Electrical Characteristics 8.1. Absolute Maximum Ratings 8.2. Recommended Operating Conditions 8.3. Current Consumption in Device States 8.4. Receiver Performance 8.5. Transmitter Performance 9. ATBTLC1000-MR110CA Module Outline Drawing 10. ATBTLC1000-MR110CA Reference Schematic 10.1. Reference Schematics 11. Placement and Routing Guidelines 11.1. Power and Ground 11.2. Interferers 12. Reflow Profile Information 12.1. Storage Condition 12.1.1. Moisture Barrier Bag Before Opening 12.1.2. Moisture Barrier Bag Open 12.2. Stencil Design 12.3. Soldering and Reflow Condition 12.3.1. Reflow Oven 12.4. Baking Conditions 12.5. Module Assembly Considerations 13. Regulatory Approval 13.1. United States (FCC) 13.1.1. Labeling And User Information Requirements 13.1.2. RF Exposure 13.1.3. Helpful Websites 13.2. Canada (ISED) 13.2.1. Labeling and User Information Requirements 13.2.2. RF Exposure 13.2.3. Helpful Websites 13.3. Japan 13.3.1. Labeling and User Information Requirements 13.3.2. Helpful Websites 13.4. Other Regulatory Information 14. Reference Documentation 15. Document Revision History The Microchip Web Site Customer Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Certified by DNV Worldwide Sales and Service