Preliminary Datasheet BM77SPPx3MC2 (Microchip) - 8
| Производитель | Microchip |
| Описание | Bluetooth 4.0 Dual Mode Module |
| Страниц / Страница | 28 / 8 — BM77SPPx3MC2. • Microchip Technology Application Note AN233 Solder Reflow … |
| Формат / Размер файла | PDF / 741 Кб |
| Язык документа | английский |
BM77SPPx3MC2. • Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)
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BM77SPPx3MC2
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• Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)
provides solder reflow recommendations
Do not exceed peak temperature (TP) of 250 deg C
Refer to the solder paste data sheet for specific reflow profile recommendations
Use no-clean flux solder paste
Do not wash as moisture can be trapped under the shield
Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. © 2014 ISSC Technologies Corp. Preliminary Revision 2.1.1 – June 16, 2015 Page 8
