Preliminary Datasheet BM77SPPx3MC2 (Microchip) - 9

BM77SPPx3MC2
FIGURE 1-6: BM77SPPS3MCS MODULE DIMENSIONS
(Side View) 1 2.0 10.2 22.0
21.2
20.1 21.5 33 19.9 18.0 18.95 17.3 18.0 16.95 shield mounting hole 14.90 13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8 13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8 1.0mm
0.7mm (Bottom View) 1.1mm 0.7 0.0 Dimentions are in millimeters
Tolerances: 0.0 0.7mm 0.5mm 9.3
8.2
7.1
6.0
4.9
3.8
2.7 2.4
0.6
0.0 shield
mounting
hole 11.2
12.0 2.7
3.8
4.9
6.0
7.1
8.2
9.3 0.0
0.8 0.0 12.0 22.0
21.2
20.1 (Bottom View) 11.2 0.8
2.0 (Top View) PCB Outline: +/-0.4 mm
PCB Thickness: +/-0.06 mm
1.0mm Pad Detail FIGURE 1-7: BM77SPPS3MC2 RECOMMEDED PCB FOOTPRINT 9.2 11.2 2.0 (Top View) 22.0
21.2
20.1 Top Copper
Keep Out Area 18.0 18.0
16.0
0.5mm
1.5mm 13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8 0.7mm
1.1mm © 2014 ISSC Technologies Corp. 12.0 2.7
3.8
4.9
6.0
7.1
8.2
9.3 0.0 0.0 Preliminary Revision 2.1.1 – June 16, 2015 Page 9