Datasheet LT1716 (Analog Devices) - 12

LT1716
PACKAGE DESCRIPTION S5 Package 5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635) 0.62 0.95 2.90 BSC MAX REF (NOTE 4) 1.22 REF 1.50 – 1.75 2.80 BSC 3.85 MAX 2.62 REF 1.4 MIN (NOTE 4) PIN ONE RECOMMENDED SOLDER PAD LAYOUT 0.30 – 0.45 TYP 0.95 BSC PER IPC CALCULATOR 5 PLCS (NOTE 3) 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 1.90 BSC NOTE: (NOTE 3) S5 TSOT-23 0302 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 Rev. B 12 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Applications Information Simplified Schematic Package Description Revision History Typical ApplicationS Related Parts